·Buffalo 2D&3D
                ·Classic2D&3D
    
    
                ·FCBIS   Semi-auto   
                ·FCBIS   Full-auto
                ·VMMS    
                ·FCVMS

     
            ·White light Interferometer
            ·Chromatic Sensor
            ·3D measuring system


  FCBIS Semi-Auto Bump Inspection System


              Flip Chip Measurement System

              With High Precision 3D Sensor

              High Speed measuring

              High Accuracy and High Performance


   FCBIS Full-Auto Bump Inspection System


              Flip Chip Measurement System

              High Speed measuring

              Automatic Sorting

              High Accuracy and High Performance

   


   VMMS Automation Inspection System
 


              Multi-Function Measurement System

              High Accuracy and High Performance
    
    
         High Precision and High Performance

             
Automation Sorting System
 
   


   FCVMS Via Dimple/Line Inspection System
 


    
             Multi-Function Measurement System


             High Accuracy and High Performance

             Customized Interface

    

 
 
                  Tel: 886-3-558-3456         fax: 886-3-558-6633       E-mail: cmi@cmi-tw.com.tw     Copyright ® 2007Cheng Mei Instrument Technology Co.,Ltd.       Design by photopro.