The system is granite-based structure which makes the measurement very precise and stable.                Programmable PLC can allow operators to control the multi-station and rotary optical inspection                function for high volume and high speed input/output of the material. High-precision multi                    sensors, algorithm, software and zero-defect sorting automatic inspection design make VMMS                a  fully automatic system on line.

        
                    Measuring Item ：
                 Bump height                 Coplanarity                 SMT height                 Warpage of Substrate
               Bump Diameter             Bump position            Missing Bump             Bump Bridge
               Bump Volume               Ball Pad height           Hole depth

                    Application ：
               Flip Chip Substrate