·Buffalo 2D&3D
                ·Classic2D&3D
    
    
                ·FCBIS   Semi-auto   
                ·FCBIS   Full-auto
                ·VMMS    
                ·FCVMS

     
            ·White light Interferometer
            ·Chromatic Sensor
            ·3D measuring system

 


  FCBIS Full-Auto Bump Inspection System
                Feature :

                The system is granite-based structure with the X/Y axes in linear motor and air-bearing design                 to increase the measurement precision and stability. Programmable PLC allow the operators to                 control the handling system and sorting system for high volume input/output of the material.                 High-precision 3D sensors, algorithm and software are expandable to meet customers' further                 requirement. The automatic sorting inspection system can be put to run on line fully                               automated.

                     Measuring Item :

                Bump Height                Coplanarity                SMT Height               
                Bump Diameter            Bump position            Missing Bump            
                Bump Volume              Ball Pad Height          Warpage of Substrate               
                  Application :
                Flip Chip Substrate


        

                                                                                                                                                              

        More info

         

         Tel: 886-3-558-3456         fax: 886-3-558-6633        E-mail: cmi@cmi-tw.com.tw     Copyright ® 2007Cheng Mei Instrument Technology Co.,Ltd.       Design by photopro.